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  1. Call for Nominations for 06 months internship at Intel

    The Chief Investigators (CIs)/ Co-CIs at Participating Institutions (PIs) [https://www.c2s.gov.in/proposallist.jsp] under Chips to Start-up (C2S) Programme may send the details of eligible students in the requisite proforma to MeitY for further processing.

    Internship location Hybrid/ Bangalore/ Hyderabad (based on Intel's business needs)
    Internship duration 6 months from July' 2024 onwards
    Eligibility B.Tech and/ or M.Tech students graduating in year 2025 with CGPA 7+ in last semester's results
    Stipend Rs. 45K for M.Tech and Rs. 40K for B.Tech (as per Intel norms/ discretion)
    Selection Process Rounds of technical interviews
    Last date to apply 17th June 2024
    Area of internship Hardware Engineering Intern and Software Engineering Intern (as described below).
    Job description for the Hardware Engineering Intern

    Digital and Analog designs covering the following areas:

    1. Working towards definition, design, verification, and documentation for SoC (System on a Chip) development.
    2. Determining architecture design, logic design, and system simulation.
    3. Performing all aspects of SoC design flow-from high-level design to synthesis, place and route, timing, and power-to create a design database that is ready for manufacturing.
    4. Translating SoC requirements to analog circuit specifications, architecting and designing analog IPs: ADC/DAC, LDOs, PLLs, temperature sensors, etc.
    5. Designing innovative analog and mixed signal circuits and contributing to delivering analog IPs in advanced Intel process nodes.
    6. Collaborating with the SoC team for IP integration, silicon tests, etc.
    7. Developing and supporting OFT strategy and implementation.
    8. Collaborating with the bench validation team for silicon validation, debugging, etc.

    Required Skillsets:

    Willing to ramp-up quickly on required areas like Microelectronics, RTL, verification/validation, structural design/physical design, analog, and so on

    Job description for the Software Engineering Intern

    Embedded, Wireless, Al/ML, Computer Science, Graphics and Firmware covering the following areas:

    1. Conducting or participating in multidisciplinary research, and collaborating with design, layout and/or hardware engineers in the design, development, and utilization of productivity enhancement layout tools and design rule checkers, as well as electronic data processing systems software.
    2. Determining computer user needs, advising hardware designers on machine characteristics that affect software systems such as storage capacity, processing speed, and input/output requirements, designing and developing compilers and assemblers, utility programs, and operating systems.
    3. Responding to customer/client requests as they occur.
    4. Developing solutions to problems utilizing requisite software-specific skillsets.

    Required Skillsets:

    1. Strong programming knowledge in either Assembly/C/C++/Embedded/Firmware.
    2. Scripting: Preferably Python.
    3. Sound logical reasoning and good aptitude.
    4. Interest in hardware setups and debugging.
    5. Basics of wireless communication systems.
    6. Understanding of Physical, MAC and Network layer in any one of the wireless standards: Wi-Fi/Bluetooth/GNSS or 3GPP - 2G/3G/4G/5G.
    7. Basic knowledge of embedded and real-time systems: interrupts, interrupt handling, timers, interfacing with hardware and so on.
  2. Call for Nominations for 12 months internship at NXP Semiconductors
    Eligible Programs M.Tech/ B.Tech (EC/ CS/ IT/ Iot/ Machine Learning/ Signal Processing) - Perusing
    Duration 10-12 Months Starting from August 2022
    Stipend Paid Rs. 35K for M.Tech and Rs. 32.5K for B.Tech
    Location Noida/ Bangalore
    Internship Domains Hardware - Digital Design and Analog Design
    Software - C, C++, Java, Python, Embedded, IoT, AI, ML
    Last Date to apply 21st July 2022
  3. Call for Nominations for 12 months internship at Intel
    Eligible Programs M.Tech/ B.Tech (pursuing)
    Duration 09-12 Months Starting from August 2022
    Stipend Paid Rs. 45K for M.Tech and Rs. 40K for B.Tech + Relocation support of $1000 as one time flexibility bonus
    Location Bangalore / Hyderabad as well an option to join online (based on business need)
    Internship Domains
    1. Working towards definition, design, verification, and documentation for SoC (System on a Chip) development
    2. Determining architecture design, logic design, and system simulation
    3. Performing all aspects of SoC design flow-from high-level design to synthesis, place and route, timing, and power-to create a design database that is ready for manufacturing
    4. Translating SoC requirements to analog circuit specifications, architecting and designing analog IPs: ADC/DAC, LDOs, PLLs, temperature sensors, etc.
    5. Designing innovative analog and mixed signal circuits and contributing to delivering analog IPs in advanced Intel process nodes
    6. Collaborating with the SoC team for IP integration, silicon tests, etc.
    7. Developing and supporting OFT strategy and implementation
    8. Collaborating with the bench validation team for silicon validation, debugging, etc.
    Last Date to apply 05th August 2022

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